Farrokh Ayazi
Electrical and Electronic Engineering · 2000–2008
A researcher in the Science corpus: 6 papers; trusts 1 researcher and is trusted by 8 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 15 citations into it; #4,158 of 16,539 by trust here, #7,892 by citations
- Atomic and Molecular Physics, and Optics — 11 citations into it; #2,018 of 7,135 by trust here, #3,591 by citations
Whom Farrokh Ayazi trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Farrokh Ayazi overall
- Siavash Pourkamali
- A. Hashimura
- Khalil Najafi
- Reza Abdolvand
- Gavin K. Ho
- Yipeng Lu
- Ahmet Erbil
- J. Schroers
Papers from Farrokh Ayazi's perspective
Ordered by how strongly the researchers Farrokh Ayazi trusts endorse each paper. Same corpus, a different order for every researcher.
- High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology (Journal of microelectromechanical systems)
- Thermal conduction in doped single-crystal silicon films
- A HARPSS polysilicon vibrating ring gyroscope
- High-Q single crystal silicon HARPSS capacitive beam resonators with self-aligned sub-100-nm transduction gaps
- Elastic Wave Transmission at an Abrupt Junction in a Thin Plate, with Application to Heat Transport and Vibrations in Mesoscopic Systems
- An analytical model for support loss in micromachined beam resonators with in-plane flexural vibrations
- A micromachined vibrating rate gyroscope with independent beams for the drive and detection modes (Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291))
- Silicon micromachining using a high-density plasma source
- Vacuum packaging technology using localized aluminum/silicon-to-glass bonding (Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090))
- MEMS post-packaging by localized heating and bonding
Their papers
- High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology (2000) — 180 citations
- High-Q single crystal silicon HARPSS capacitive beam resonators with self-aligned sub-100-nm transduction gaps (2003) — 184 citations
- A HARPSS polysilicon vibrating ring gyroscope (2001) — 400 citations
- An analytical model for support loss in micromachined beam resonators with in-plane flexural vibrations (2003) — 414 citations
- An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon (2008) — 155 citations
- A Mode-Matched Silicon-Yaw Tuning-Fork Gyroscope With Subdegree-Per-Hour Allan Deviation Bias Instability (2008) — 178 citations