An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon

By Reza Abdolvand, Farrokh Ayazi. 2008

155 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/083532114f924ae9108979cedfa14c79a57c2006