Silicon micromachining using a high-density plasma source

By S. McAuley, H. Ashraf, Lilian Atabo, A. Chambers, S. Hall, J. Hopkins, G. Nicholls. 2001

182 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/f515f1bcb6628569ab46b6189d7c0c446bf716b8

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In Electrical and Electronic Engineering

1. Farrokh Ayazi

Citations in the corpus

• A Mode-Matched Silicon-Yaw Tuning-Fork Gyroscope With Subdegree-Per-Hour Allan Deviation Bias Instability (2008, background): “During resonant flexural vibrations, the proof-masses exert a time-harmonic load on the support structure.”
• Monitoring General Linear Profiles Using Multivariate Exponentially Weighted Moving Average Schemes (2007, unknown): “…process involves complex chemical–mechanical reactions on a machine called an inductively coupled plasma silicon etcher made by Surface Technology Systems Ltd. (See McAuley et al. 2001; Rauf, Dauksher, Clemens, and Smith 2002; Zhou, Zhang, Hao, and Wang 2004 for more details about this system.)”