Nick Baker

Electrical and Electronic Engineering · 2005–2016

A researcher in the Science corpus: 2 papers; trusts 2 researchers and is trusted by 1 researcher here, as inferred from the citation graph.

Subfields

Whom Nick Baker trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Yvan Avenas
  2. Laurent Dupont
  3. David L. Blackburn

Who trusts Nick Baker overall

  1. Andreas Willig
  2. U. Choi
  3. Jin-Shyan Lee
  4. Wencong Su
  5. Luis Ruiz-Garcia
  6. Frede Blaabjerg

Papers from Nick Baker's perspective

Ordered by how strongly the researchers Nick Baker trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the Vce(T)-measurement (EPE)
  2. Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters (IEEE transactions on industry applications)
  3. Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters—A Review (IEEE transactions on power electronics)
  4. Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities (IEEE Industrial Electronics Magazine)
  5. Temperature measurements of semiconductor devices - a review (Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545))
  6. Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
  7. On-line junction temperature measurement of IGBTs based on temperature sensitive electrical parameters (EPE)
  8. Evaluation of the switching characteristics of a gallium-nitride transistor (2011 IEEE Energy Conversion Congress and Exposition)
  9. Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules (IEEE transactions on device and materials reliability)
  10. Prognostics and health management of electronics (International Symposium on Advanced Packaging Materials)

Their papers