Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

By Pearl A. Agyakwa, C. Mark Johnson. IEEE transactions on device and materials reliability, 2013

173 citations recorded by the source corpus.

This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological considerations based on some unusual observations highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/0a126b0515ff8b565bfa395a72ce51f9f99a56fe

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In Electrical and Electronic Engineering

1. Frede Blaabjerg
2. Huai Wang
3. U. Choi
4. Marco Liserre
5. Kyo-Beum Lee
6. Yihua Hu
7. Wenping Cao
8. Xiongfei Wang

Citations in the corpus

• Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics (2014, background): “Especially, much interesting work from the semiconductor side investigates the failure mechanisms of insulated-gate bipolar transistor (IGBT) modules [51] and physical-based lifetime models [52].”
• In Situ Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives (2015, methodology): “method utilizes a parameterized physics of failure (PoF) model [36], [37] to determine the degradation based on life-cycle loads, material properties, and packaging factor [14].”
• Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems (2015, methodology): “b) Lifetime models for wire bond: Besides the physics lifetime models of solder joint, the lifetime models for Al wire bond also has been proposed [73]–[75].”