IGBT Junction Temperature Measurement via Peak Gate Current
By Nick Baker, S. Munk‐Nielsen, Francesco Iannuzzo, Marco Liserre. IEEE transactions on power electronics, 2016
147 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/cf9ebd7f46936410e297fe5d1b13a84d4b8b255c
How researchers see this paper
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In Electrical and Electronic Engineering
- U. Choi
- Frede Blaabjerg
- Søren Jørgensen
- Xiongfei Wang
- Huai Wang
- Marco Liserre
- Friedrich Wilhelm Fuchs
- Yun Wei Li
Citations in the corpus
- Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress (2018, methodology): “RG int of one IGBT inside an Infineon FS200R12PT4 module under different temperatures [81].”