Wafer level packaging of MEMS

By Masayoshi Esashi. TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference, 2008

361 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/e6636550de2bd53728274ebc7a3e4bedaff20e4d

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In Electrical and Electronic Engineering

1. Göran Stemme
2. M. Lapisa
3. Frank Niklaus

Citations in the corpus

• Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS (2011, background): “thoroughly in recent publications [8], [9] and are not part of the present review.”
• Vacuum-packaged piezoelectric vibration energy harvesters: damping contributions and autonomy for a wireless sensor system (2010, neutral): “A third option can be found in replacing the polymer SU-8 bond with a metallic eutectic bond which will not suffer from diffusion and is known to be hermetic [17].”