Frank Niklaus
Electrical and Electronic Engineering · 2001–2015
A researcher in the Science corpus: 5 papers; trusts 2 researchers and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 25 citations into it
Whom Frank Niklaus trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Frank Niklaus overall
Papers from Frank Niklaus's perspective
Ordered by how strongly the researchers Frank Niklaus trusts endorse each paper. Same corpus, a different order for every researcher.
- Self-Assembly at All Scales (Science)
- III-V/Si photonics by die-to-wafer bonding
- Demystifying 3D ICs: the pros and cons of going vertical (IEEE Design & Test of Computers)
- Three-dimensional integrated circuits (IBM Journal of Research and Development)
- Fundamentals of Microsystems Packaging
- Large scale, highly ordered assembly of nanowire parallel arrays by differential roll printing
- Theory and phenomenology of type I strings and M-theory
- Hybrid Integrated Platforms for Silicon Photonics (Materials)
- Micromachined infrared detectors based on pyroelectric thin films
- Effects of Ti–W codoping on the optical and electrical switching of vanadium dioxide thin films grown by a reactive pulsed laser deposition
Their papers
- Adhesive wafer bonding (2006) — 167 citations
- Integrating MEMS and ICs (2015) — 323 citations
- Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS (2011) — 140 citations
- MEMS-based uncooled infrared bolometer arrays: a review (2007) — 366 citations
- Low temperature full wafer adhesive bonding (2001) — 260 citations