Low temperature full wafer adhesive bonding

By Frank Niklaus, P. Enoksson, E. Kälvesten, Göran Stemme. 2001

260 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/8a8c5306d6e1b2e8a268b912a962f67b68b68ce5