Hybrid Integrated Platforms for Silicon Photonics

By Di Liang, Gunther Roelkens, R. Baets, John E. Bowers. Materials, 2010

313 citations recorded by the source corpus.

A review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues such as bonding process and mechanism, bonding strength, uniformity, wafer surface requirement, and stress distribution are studied in detail. The application in silicon photonics to realize high-performance active and passive photonic devices on low-cost silicon wafers is discussed. Hybrid integration is believed to be a promising technology in a variety of applications of silicon photonics.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/eeb5dc9aff87da2a84fd13e596401dc63a1b4ff6

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In Biomedical Engineering

1. David A. B. Miller
2. Wim Bogaerts

In Electrical and Electronic Engineering

1. Lukas Chrostowski
2. Michael Hochberg
3. Bhavin J. Shastri
4. Paul R. Prucnal
5. Alexander N. Tait
6. Mitchell A. Nahmias
7. Chao Li
8. Sudip Shekhar

Citations in the corpus

• Roadmapping the next generation of silicon photonics (2023, methodology): “Integration proximity of the (dissimilar) materials in direct bonding facilitates superior optical coupling and heat transportation between them [56].”
• Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS (2011, background): “silicon-based waveguide structures [87], [122]–[128], but it is, in principle, also an attractive approach for MOEMS, MEMS, and NEMS devices.”
• Advances in quantum cryptography (2019, unknown): “While the development of a fully integrated light source within the silicon photonics platform is still underway, the platform has been proven to be highly amenable to heterogeneous bonding of the active III–V materials mentioned above [296–300].”
• Photonic matrix multiplication lights up photonic accelerator and beyond (2022, methodology): “And hybrid integration technology is signi fi cant for integrating the low-loss passive silicon or silicon nitride waveguides with the active ampli fi ers and lasers 141 – 143 .”
• Broadcast and Weight: An Integrated Network For Scalable Photonic Spike Processing (2014, background): “The first platforms for systems integration of active photonics are becoming commercial reality [18], [19], and promise to bring the economies of integrated circuit manufacturing to optical systems.”
• Attojoule Optoelectronics for Low-Energy Information Processing and Communications (2016, background): “proaches that can avoid problems with lattice mismatch [117], [119], [124], [173], [174], [175], or using heterogeneous integration of III-V device structures [50], [171], [172], [176], [177] or other materials such as organics [87], [109] 4) technology for electrically connecting such optoelectroni”
• Review of Silicon Photonics Technology and Platform Development (2021, background): “to table this: laser integration into silicon via packaging [27], and the more ambition silicon-based lasers [28].”
• Hybrid Silicon Photonic Integrated Circuit Technology (2013, unknown): “bonding [21].”
• Ring Resonator Modulators in Silicon for Interchip Photonic Links (2013, unknown): “bonding of III–V gain material on Si for on-chip lasers [73].”