Fundamentals of Microsystems Packaging

By R. Tummala. 2001

581 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/0d04adc5bc1385458da95a37e3349d272be9f909

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. M. Lapisa
2. Göran Stemme
3. Frank Niklaus

Citations in the corpus

• Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS (2011, background): “dividual chips can be established by forming wire bonds or by flip-chip bonding using bump bonds [5].”