Dan-Liang Yang

Electrical and Electronic Engineering · 2010

A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Dan-Liang Yang trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. King-Ning Tu

Papers from Dan-Liang Yang's perspective

Ordered by how strongly the researchers Dan-Liang Yang trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
  2. Solder Joint Technology
  3. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
  4. Thermomigration in SnPb composite flip chip solder joints
  5. Theory of Elasticity
  6. International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －
  7. Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps (IEEE Transactions on Advanced Packaging)
  8. Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV) (Electronic Components and Technology Conference)
  9. A study of thermo-mechanical stress and its impact on through-silicon vias
  10. Uniaxial-process-induced strained-Si: extending the CMOS roadmap (IEEE Transactions on Electron Devices)

Their papers