Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

By Yan Cheong Chan, Dan-Liang Yang. 2010

267 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/49fb57ab8fcdb179befdbe9773efa618ea2865ed