Uniaxial-process-induced strained-Si: extending the CMOS roadmap

By S. Thompson, Guangyu Sun, Y. Choi, Toshikazu Nishida. IEEE Transactions on Electron Devices, 2006

572 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/0891b2312552ce8d576271d043ec539a413eed28

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Rui Huang

Citations in the corpus

• Thermo-mechanical reliability of 3-D ICs containing through silicon vias (2009, background): “It has been reported that 100 MPa of stress can change more than 7% of carrier mobility in MOSFET devices [3].”