John H. Lau

Electronic Components and Technology Conference · 2002–2017

A researcher in the Science corpus: 8 papers; trusts 0 researchers and is trusted by 1 researcher here, as inferred from the citation graph.

Who trusts John H. Lau overall

  1. Satish G. Kandlikar

Papers from John H. Lau's perspective

Ordered by how strongly the researchers John H. Lau trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Cramming More Components Onto Integrated Circuits
  2. Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring (Electronic Components and Technology Conference)
  3. 3D silicon integration (Electronic Components and Technology Conference)
  4. Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps (Electronic Components and Technology Conference)
  5. An embedded device technology based on a molded reconfigured wafer (Electronic Components and Technology Conference)
  6. Thermal management of 3D IC integration with TSV (through silicon via) (Electronic Components and Technology Conference)
  7. Electrical integrity of state-of-the-art 0.13 /spl mu/m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication (Digest. International Electron Devices Meeting,)
  8. Three-dimensional integrated circuits (IBM Journal of Research and Development)
  9. Γ and B
  10. Influence of cultivation temperature on the ligninolytic activity of selected fungal strains

Their papers