An embedded device technology based on a molded reconfigured wafer

By M. Brunnbauer, Edward Fürgut, G. Beer, Thorsten Meyer, H. Hedler, J. Belonio, E. Nomura, K. Kiuchi, K. Kobayashi. Electronic Components and Technology Conference, 2006

168 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/38e5a86c90b122e2e2c48f6c9f4cb9a966c02a67

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In Electrical and Electronic Engineering

1. John H. Lau

Citations in the corpus

• Millimeter-Wave Technology for Automotive Radar Sensors in the 77 GHz Frequency Band (2012, background): “The authors would like to thank Infineon for providing the millimeter-wave integrated circuits.”
• Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging (2017, background): “I. INTRODUCTION THE first fan-out wafer-level packaging (FOWLP) U.S.patent was filed by Infineon on October 31, 2001 [1], [2], and the first technical papers were also published (at ECTC2006 and EPTC2006) by Infineon and their industry partners: Nagase, Nitto Denko, and Yamada [3], [4].”