TSV manufacturing yield and hidden costs for 3D IC integration

By John H. Lau. Electronic Components and Technology Conference, 2010

157 citations recorded by the source corpus.

Subfields: Automotive Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/2d1a9076bde3117728e984dbe0ae261ddf5d59a7

How researchers see this paper

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In Automotive Engineering

1. John H. Lau

In Electrical and Electronic Engineering

1. John H. Lau

Citations in the corpus

• Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration (2011, background): “99%) for the CPU (or logic) to bear additional costs due to yield loss [10].”