Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

By John H. Lau, Ming Li, D. Tian, N. Fan, E. Kuah, Wu Kai, Margie Li, J. Hao, Y. Cheung, Zhang Li and 12 more. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2017

146 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/58e7ba9796ef2bf7d8d494d8d6907a7031f54fff