Bin Du

IEEE transactions on power electronics · with Bryant · 2010

A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Whom Bin Du trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Ahmer Syed

Who trusts Bin Du overall

  1. Ke Ma

Papers from Bin Du's perspective

Ordered by how strongly the researchers Bin Du trusts endorse each paper. Same corpus, a different order for every researcher.

  1. A thermal model for insulated gate bipolar transistor module (IEEE transactions on power electronics)
  2. Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy (2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220))
  3. Thermal component model for electrothermal analysis of IGBT module systems
  4. An assessment of wide bandgap semiconductors for power devices
  5. Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
  6. Selected failure mechanisms of modern power modules (Microelectronics and reliability)
  7. Exploration of Power Device Reliability Using Compact Device Models and Fast Electrothermal Simulation (IEEE transactions on industry applications)
  8. Two-step parameter extraction procedure with formal optimization for physics-based circuit simulator IGBT and p-i-n diode models (IEEE transactions on power electronics)
  9. Control system design (at - Automatisierungstechnik)
  10. Closure on "Theoretical and experimental analyses of photovoltaic systems with voltage and current-based maximum power point tracking"

Their papers