Thermal component model for electrothermal analysis of IGBT module systems

By C. Yun, P. Malberti, M. Ciappa, W. Fichtner. 2001

163 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/d7868896fae37bdc4365119f2ebacf94e629f355

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. M. Nokali
2. Zhaohui Luo
3. Hyungkeun Ahn

Citations in the corpus

• A thermal model for insulated gate bipolar transistor module (2004, methodology): “Natural air, forced air or water-cooling [8] are typical methods of cooling used.”