Exploration of Power Device Reliability Using Compact Device Models and Fast Electrothermal Simulation

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Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise (2011, methodology): “Losses are modeled using a lookup table of the average loss in a switching cycle P against a point in the operating space, i.e., P = f (i, ρ, Tj); the dc-link voltage Vdc and switching frequency fsw are kept constant [ 25 ].”
Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules (2013, background): “Therefore, this relationship has been adopted by many researchers to evaluate the thermal fatigue lifetime for wire bonds [26], [27].”
A Lifetime Estimation Technique for Voltage Source Inverters (2013, background): “Previous studies of lifetime prediction focus either at device level [2]–[4], which assume constant temperature cycle during operation, or at system level [5], [6], [23], of which the accuracy has not been proven.”
Investigation Into IGBT dV/dt During Turn-Off and Its Temperature Dependence (2011, background): “This may be used in thermal cycle counting [4], [10], [11] to estimate the consumed lifetime of the converter, and hence, allow predictive maintenance to take place.”