Ahmer Syed
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) · 2001–2004
A researcher in the Science corpus: 2 papers; trusts 0 researchers and is trusted by 6 researchers here, as inferred from the citation graph.
Who trusts Ahmer Syed overall
Papers from Ahmer Syed's perspective
Ordered by how strongly the researchers Ahmer Syed trusts endorse each paper. Same corpus, a different order for every researcher.
- Mechanical Behavior of Materials: Engineering Methods for Deformation, Fracture, and Fatigue
- High Speed Signal Propagation: Advanced Black Magic
- Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture (Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.)
- Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid
- Forced convective heat transfer across a pin fin micro heat sink
- High RF performance TSV silicon carrier for high frequency application (Electronic Components and Technology Conference)
- Inductance: Loop and Partial