Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy

By Ahmer Syed. 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001

136 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/98f7530fb9b719e67c9cb690ae718732fb7f87b2

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Aerospace Engineering

1. Bin Du
2. A. Bryant
3. Patrick R. Palmer
4. Enrico Santi
5. Jerry L. Hudgins
6. H. Mantooth

In Electrical and Electronic Engineering

1. Bin Du
2. A. Bryant
3. Patrick R. Palmer
4. Enrico Santi
5. Jerry L. Hudgins
6. H. Mantooth
7. P. Mawby
8. Hui Huang

Citations in the corpus

• Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints (2004, unknown): “Life Prediction Methodology A number of life prediction models have been proposed in the literature for SnPb solder [5, 12, 13] and more recently for SnAgCu solder interconnects [7, 8].”
• Transient Electrothermal Simulation of Power Semiconductor Devices (2010, methodology): “Most research uses finite-element methods (FEMs) to achieve the exact solution [3]–[6].”