Vertical GaN-Based Trench Gate Metal Oxide Semiconductor Field-Effect Transistors on GaN Bulk Substrates
By H. Otake, K. Chikamatsu, A. Yamaguchi, T. Fujishima, H. Ohta. 2008
184 citations recorded by the source corpus.
Subfields: Condensed Matter Physics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/851214f49bc7ddc2c884a67f1f1d30c9dd3ee4a1
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In Condensed Matter Physics
In Electrical and Electronic Engineering
Citations in the corpus
- Electrothermal Simulation and Thermal Performance Study of GaN Vertical and Lateral Power Transistors (2013, background): “1(a)] and bulk and channel mobility were set to the values reported in [11].”
- High-Performance GaN Vertical Fin Power Transistors on Bulk GaN Substrates (2017, background): “Some vertical GaN transistors have been demonstrated in the past few years, and they typically fall into two designs: current aperture vertical electron transistor (CAVET) ([13]–[15]) and trench MOSFET ( [16]–[20]).”
- Dynamic On-Resistance in GaN Power Devices: Mechanisms, Characterizations, and Modeling (2019, background): “In the meantime, vertical GaN-on-GaN transistors with relatively high channel electron mobility have been reported recently [104], [105], which are desirable for low RCH/RON ratio and low susceptibility to VTH shift.”