Pierre-Olivier Jeannin
IEEE transactions on industry applications · 2013
A researcher in the Science corpus: 1 paper; trusts 0 researchers and is trusted by 3 researchers here, as inferred from the citation graph.
Who trusts Pierre-Olivier Jeannin
- Zoubir Khatir (in Electrical and Electronic Engineering)
- Yvan Avenas (in Electrical and Electronic Engineering)
- Laurent Dupont (in Electrical and Electronic Engineering)
Papers from Pierre-Olivier Jeannin's perspective
Ordered by how strongly the researchers Pierre-Olivier Jeannin trusts endorse each paper. Same corpus, a different order for every researcher.
- Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the Vce(T)-measurement (EPE)
- Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
- SOI thermal impedance extraction methodology and its significance for circuit simulation
- Measurement of temperature in active high-power AlGaN/GaN HFETs using Raman spectroscopy (IEEE Electron Device Letters)
- A thermal model for insulated gate bipolar transistor module (IEEE transactions on power electronics)
- Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy (2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220))
- An assessment of wide bandgap semiconductors for power devices
- Two-step parameter extraction procedure with formal optimization for physics-based circuit simulator IGBT and p-i-n diode models (IEEE transactions on power electronics)
- I and i
- Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))