SOI thermal impedance extraction methodology and its significance for circuit simulation

By W. Jin, Weidong Liu, S. Fung, Philip C. H. Chan, Chenming Calvin Hu. 2001

159 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/5a9f5321083e1ae2d803dd4638c72c59fe02ea66

How researchers see this paper

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In Electrical and Electronic Engineering

1. Eric Pop
2. David L. Blackburn

Citations in the corpus

• Energy dissipation and transport in nanoscale devices (2010, background): “5: (a) Measured thermal resistance of individual devices [13, 14, 30, 67-78].”
• Temperature measurements of semiconductor devices - a review (2004, background): “A number of researchers have used the ac, or small signal, output conductance of these devices to measure their temperature [42-45].”