Yingxia Liu

Electrical and Electronic Engineering · 2019

A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Yingxia Liu trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. King-Ning Tu

Papers from Yingxia Liu's perspective

Ordered by how strongly the researchers Yingxia Liu trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
  2. Solder Joint Technology
  3. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
  4. Thermomigration in SnPb composite flip chip solder joints
  5. Mechanical Behavior of Materials: Engineering Methods for Deformation, Fracture, and Fatigue
  6. Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements
  7. Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing
  8. Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
  9. Phase equilibria of the Sn–Zn–Cu ternary system
  10. Solder Joint Technology: Materials, Properties, and Reliability

Their papers