Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

By B. Chao, Seung-Hyun Chae, Xuefeng Zhang, K. Lu, J. Im, P. Ho. 2007

210 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/2782747e04bcef2e56bb9dbe8ec4fa4f5bac77ba

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “Also, a kinetic model was formulated to verify the linear growth of the IMC layer when an EM driving force dominates the chemical interdiffusion [83,84].”
• A review: On the development of low melting temperature Pb-free solders (2014, background): “Literature values range from 1/5 to 1 [42] depending on temperature, time interval, and solder composition.”