Göran Stemme
Electrical and Electronic Engineering · 2000–2015
A researcher in the Science corpus: 5 papers; trusts 2 researchers and is trusted by 2 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 18 citations into it; #13,191 of 16,539 by trust here, #9,011 by citations
Whom Göran Stemme trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Göran Stemme overall
Papers from Göran Stemme's perspective
Ordered by how strongly the researchers Göran Stemme trusts endorse each paper. Same corpus, a different order for every researcher.
- Self-Assembly at All Scales (Science)
- III-V/Si photonics by die-to-wafer bonding
- Three-dimensional integrated circuits (IBM Journal of Research and Development)
- Fundamentals of Microsystems Packaging
- Large scale, highly ordered assembly of nanowire parallel arrays by differential roll printing
- Theory and phenomenology of type I strings and M-theory
- Demystifying 3D ICs: the pros and cons of going vertical (IEEE Design & Test of Computers)
- Hybrid Integrated Platforms for Silicon Photonics (Materials)
- Influence of cultivation temperature on the ligninolytic activity of selected fungal strains
- A Stueckelberg extension of the Standard Model
Their papers
- Micromachined flow-through filter-chamber for chemical reactions on beads (2000) — 155 citations
- Integrating MEMS and ICs (2015) — 323 citations
- Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS (2011) — 140 citations
- A Valve-Less Diffuser Micropump for Microfluidic Analytical Systems (2001) — 231 citations
- Low temperature full wafer adhesive bonding (2001) — 260 citations