Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS

By Khalil Najafi. SPIE MOEMS-MEMS, 2003

162 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/0f8633b205ba47577a166e390c8f775a8961ae82

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In Electrical and Electronic Engineering

1. A. Razali

Citations in the corpus

• Micro-manufacturing: research, technology outcomes and development issues (2010, background): “Assembly of individual technical components to hybrid micro-systems is a bottleneck to large-scale production [ 36 ], which is evident especially in the areas of heterogeneous assembly, online-inspection and quality control.”