Enhancement‐mode AlGaN/GaN HEMT and MIS‐HEMT technology
By Kevin J. Chen, Chunhua Zhou. 2011
169 citations recorded by the source corpus.
Subfields: Condensed Matter Physics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/3fe45801a9f8f736e157e277ad03edeefcd58406
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In Condensed Matter Physics
In Electrical and Electronic Engineering
Citations in the corpus
- Maximizing the Performance of 650-V p-GaN Gate HEMTs: Dynamic RON Characterization and Circuit Design Considerations (2017, methodology): “sistor can be fabricated using p-GaN gate technique [3]–[7], gate recess [7]–[9] or plasma treatment [10]–[12].”
- VTH Instability of ${p}$ -GaN Gate HEMTs Under Static and Dynamic Gate Stress (2018, unknown): “[3] K.”
- Technology and Reliability of Normally-Off GaN HEMTs with p-Type Gate (2017, background): “[15] indicate that on recent devices an excellent stability of fluorine atoms can be obtained through F-plasma ion implantation.”
- 600-V Normally Off ${\rm SiN}_{x}$ /AlGaN/GaN MIS-HEMT With Large Gate Swing and Low Current Collapse (2013, background): “NORMALLY-OFF operation is of necessity when gallium nitride-based power transistors are targeting at high-voltage power switching applications because of the fail-safe requirement in a power conversion system [1].”