Current instabilities in GaN-based devices
By I. Daumiller, Didier Théron, C. Gaquière, Andrei Vescan, R. Dietrich, A. Wieszt, H. Leier, Ramakrishna Vetury, Umesh K. Mishra, I. Smorchkova and 3 more. IEEE Electron Device Letters, 2001
157 citations recorded by the source corpus.
Subfields: Condensed Matter Physics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/12591be5beac219b55d5baeb053529dc365aa5d8
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In Condensed Matter Physics
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In Electrical and Electronic Engineering
Citations in the corpus
- AlGaN-GaN double-channel HEMTs (2005, background): “Theoretically, PAE increases during the transition from Class A mode to Class B mode (i.e., quiescent moves from V to V for this double-channel HEMT under study).”
- InAlN/GaN HEMTs: a first insight into technological optimization (2006, background): “Phenomena of current collapse [21], [22], breakdown characteristics of the HEMT [23] and free/passivated surface behavior [21]–[23] have been investigated for AlGaN/GaN HEMTs previously.”
- Surface-related drain current dispersion effects in AlGaN-GaN HEMTs (2004, background): “I. INTRODUCTION RF drain-current ( ) collapse is the major factor limitingthe output-power density at microwave frequencies in GaN-based FETs [1].”