James A. Hutchby
Proceedings of the IEEE · 1964–2005
A researcher in the Science corpus: 4 papers; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.
Whom James A. Hutchby trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from James A. Hutchby's perspective
Ordered by how strongly the researchers James A. Hutchby trusts endorse each paper. Same corpus, a different order for every researcher.
- Analytic description of short-channel effects in fully-depleted double-gate and cylindrical, surrounding-gate MOSFETs (IEEE Electron Device Letters)
- Assessment of high-heat-flux thermal management schemes (ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069))
- Complementary silicide source/drain thin-body MOSFETs for the 20 nm gate length regime (International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138))
- A logic nanotechnology featuring strained-silicon (IEEE Electron Device Letters)
- RF/wireless interconnect for inter- and intra-chip communications (Proceedings of the IEEE)
- Extension and source/drain design for high-performance FinFET devices
- Extreme scaling with ultra-thin Si channel MOSFETs (Digest. International Electron Devices Meeting,)
- Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
- Transport Phenomena in Two-Phase Micro-Channel Heat Sinks
- A uniform temperature heat sink for cooling of electronic devices
Their papers
- Limits to binary logic switch scaling - a gedanken model (2003) — 479 citations
- The end of CMOS scaling: toward the introduction of new materials and structural changes to improve MOSFET performance (2005) — 418 citations
- High-performance interconnects: an integration overview (2001) — 346 citations
- International (1964)