M. Lapisa
Electrical and Electronic Engineering · 2011–2015
A researcher in the Science corpus: 2 papers; trusts 2 researchers and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 19 citations into it
Whom M. Lapisa trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from M. Lapisa's perspective
Ordered by how strongly the researchers M. Lapisa trusts endorse each paper. Same corpus, a different order for every researcher.
- Self-Assembly at All Scales (Science)
- III-V/Si photonics by die-to-wafer bonding
- Three-dimensional integrated circuits (IBM Journal of Research and Development)
- Demystifying 3D ICs: the pros and cons of going vertical (IEEE Design & Test of Computers)
- Fundamentals of Microsystems Packaging
- Large scale, highly ordered assembly of nanowire parallel arrays by differential roll printing
- Theory and phenomenology of type I strings and M-theory
- Hybrid Integrated Platforms for Silicon Photonics (Materials)
- Influence of cultivation temperature on the ligninolytic activity of selected fungal strains
- A Stueckelberg extension of the Standard Model
Their papers
- Integrating MEMS and ICs (2015) — 323 citations
- Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS (2011) — 140 citations