Gunther Roelkens
Electrical and Electronic Engineering · 2005–2020
A researcher in the Science corpus: 17 papers; trusts 5 researchers and is trusted by 1 researcher here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 142 citations into it; #16,536 of 16,539 by trust here, #2,925 by citations
- Atomic and Molecular Physics, and Optics — 84 citations into it
- Surfaces, Coatings and Films — 10 citations into it
Whom Gunther Roelkens trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Gunther Roelkens overall
Papers from Gunther Roelkens's perspective
Ordered by how strongly the researchers Gunther Roelkens trusts endorse each paper. Same corpus, a different order for every researcher.
- An out-of-plane grating coupler for efficient butt-coupling between compact planar waveguides and single-mode fibers
- Efficient silicon-on-insulator fiber coupler fabricated using 248-nm-deep UV lithography (IEEE Photonics Technology Letters)
- III-V/Si photonics by die-to-wafer bonding
- Supercontinuum generation in photonic crystal fiber
- New CMOS-compatible platforms based on silicon nitride and Hydex for nonlinear optics (Nature Photonics)
- Biosensing with plasmonic nanosensors. (Nature Materials)
- Influence of cultivation temperature on the ligninolytic activity of selected fungal strains
- Low loss mode size converter from 0.3 /spl mu/m square Si wire waveguides to singlemode fibres
- Optical modelling of photonic crystals and VCSELs using eigenmode expansion and perfectly matched layers
- Hybrid silicon evanescent devices
Their papers
- Efficient silicon-on-insulator fiber coupler fabricated using 248-nm-deep UV lithography (2005) — 147 citations
- Compact and Highly Efficient Grating Couplers Between Optical Fiber and Nanophotonic Waveguides (2007) — 396 citations
- Hybrid Integrated Platforms for Silicon Photonics (2010) — 313 citations
- III-V/Si photonics by die-to-wafer bonding (2007) — 208 citations
- An introduction to InP-based generic integration technology (2014) — 630 citations
- III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects (2010) — 578 citations
- Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate (2013) — 192 citations
- An ultra-small, low-power all-optical flip-flop memory on a silicon chip (2010) — 431 citations
- Bridging the mid-infrared-to-telecom gap with silicon nanophotonic spectral translation (2012) — 158 citations
- Optical switching at 1.55 μm in silicon racetrack resonators using phase change materials (2013) — 206 citations
- High efficiency diffractive grating couplers for interfacing a single mode optical fiber with a nanophotonic silicon-on-insulator waveguide circuit (2008) — 181 citations
- Silicon and silicon nitride photonic circuits for spectroscopic sensing on-a-chip [Invited] (2015) — 202 citations
- III-V-on-Silicon Photonic Devices for Optical Communication and Sensing (2015) — 142 citations
- Adhesive Bonding of InP ∕ InGaAsP Dies to Processed Silicon-On-Insulator Wafers using DVS-bis-Benzocyclobutene (2006) — 155 citations
- Expanding the Silicon Photonics Portfolio With Silicon Nitride Photonic Integrated Circuits (2017) — 277 citations
- Assessment on the Achievable Throughput of Multi-Band ITU-T G.652.D Fiber Transmission Systems (2020) — 241 citations
- Germanium-on-Silicon Mid-Infrared Arrayed Waveguide Grating Multiplexers (2013) — 143 citations