Daniel Josell

Electrical and Electronic Engineering · 2000–2012

A researcher in the Science corpus: 7 papers; trusts 2 researchers and is trusted by 2 researchers here, as inferred from the citation graph.

Subfields

Whom Daniel Josell trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Thomas P. Moffat

Who trusts Daniel Josell overall

  1. D. Gall

Papers from Daniel Josell's perspective

Ordered by how strongly the researchers Daniel Josell trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films (Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407))
  2. Reduced electromigration of Cu wires by surface coating
  3. Alteration of Cu conductivity in the size effect regime
  4. Phase-Field Models for Microstructure Evolution
  5. Phase field modeling of defects and deformation
  6. What is spinodal decomposition
  7. Phase-Field Simulation of Solidification
  8. Phase-field models in materials science
  9. Thermochemical compatibility between alumina and ZrO2–GdO3/2 thermal barrier coatings
  10. Yttrium Silicate Coatings for Oxidation Protection of Carbon–Silicon Carbide Composites

Their papers