Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films

By Haebum Lee, S. Lopatin, S. Wong. Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407), 2000

132 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/102b32ce03a48b5f3979fc0b99725f1c8cf19b43

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Citations in the corpus

• Size-Dependent Resistivity in Nanoscale Interconnects (2009, background): “The temperature-dependent resistivity confirms this: Smoothly decreasing resistivity is observed”