Superconformal Electrodeposition of Copper in 500–90 nm Features

By Thomas P. Moffat, J. Bonevich, W. Huber, A. Stanishevsky, D. R. Kelly, G. Stafford, Daniel Josell. 2000

373 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/41aa5ed00c2b26312dd789a24a34a5c06094c44e