Reduced electromigration of Cu wires by surface coating

By Chao-Kun Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Domenicucci, Xiaogang Chen, A. Stamper. 2002

196 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/11a917bf75b93c1033aa5c14781707db69682784

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In Electrical and Electronic Engineering

1. Daniel Josell

Citations in the corpus

• Size-Dependent Resistivity in Nanoscale Interconnects (2009, background): “Accuratevalues ofconductor dimensions, grain size, and geometry are required for unambiguous determination of surface spec-ularity below 100 nm, obtaining sufficiently”