Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS

By Thomas P. Moffat, Daniel Wheeler, Daniel Josell. 2004

329 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electrochemistry, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/47538e6d664d9ab8cce9198d1da6606e064fd81b