Forced convective heat transfer across a pin fin micro heat sink

By Yoav Peles, Ali Kosar, C. Mishra, C. Kuo, Brandon Schneider. 2005

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Interlayer cooling potential in vertically integrated packages (2008, background): “Low-aspect-ratio pin-fin heat-transfer structures at Reynolds (Re) numbers B1,000 were analyzed by other groups, but only for single-side heat flux with a glass cover on the cavity ( Peles et al. 2005; Prasher et al. 2007; Kosar et al. 2007), a configuration that does not reflect the double-side he”
Three dimensional numerical analyses and optimization of offset strip-fin microchannel heat sinks (2009, background): “Advanced microchannel structures, such as two-layered parallel-microchannels [2], stacked microchannels [3], tree-shaped microchannel network [4], and stripfinmicrochannels [5,6] or micro-pin fin [7–10], have been proposed to lower the pressure drop and enhance temperature uniformity.”
History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat Transfer in Microchannels: A Critical Review (2012, background): “[69] presented experimental data on micropin fins and obtained a very low thermal resistance value, comparable to the microchannel flows.”