Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints
By Ahmer Syed. 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004
407 citations recorded by the source corpus.
Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/c822a2963873b19148fb35af3f0aa606379685f8
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In Aerospace Engineering
In Electrical and Electronic Engineering
In Mechanical Engineering
Citations in the corpus
- Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints (2008, background): “cent Sn, and because the physical and mechanical properties of Sn are very different from Pb, the behaviors of Sn–Ag–Cu joints are not like the well characterized Pb–Sn system [1]–[9].”