Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture

By T. Brunschwiler, Hugo E. Rothuizen, Matteo Fabbri, U. Kloter, Bruno Michel, R. J. Bezama, G. Natarajan. Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006., 2006

132 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/1b33e99fcadfde7af41b1e443b825ce86affea04

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Computational Mechanics

1. Suresh V. Garimella
2. L. Wojtan
3. Bruno Michel
4. B. Agostini
5. Matteo Fabbri
6. J. E. Park
7. J. Weibel
8. John Richard Thome

In Mechanical Engineering

1. Suresh V. Garimella
2. John Richard Thome
3. L. Wojtan
4. Bruno Michel
5. B. Agostini
6. Matteo Fabbri
7. J. Weibel
8. J. E. Park

Citations in the corpus

• State of the Art of High Heat Flux Cooling Technologies (2007, methodology): “[ 30 ] built and then tested several submerged jet cooling modules with a parallel fluid return system.”
• Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions (2018, background): “footprint dimensions and smaller inlet and outlet features [32].”
• Interlayer cooling potential in vertically integrated packages (2008, background): “Chipback-side heat removal in high-performance applications utilizing state-of-the-art thermal interfaces (Linderman et al. 2007) and microchannel cold-plates (Colgan et al. 2007; Brunschwiler et al. 2006 ) is only capable of handling a single logic layer combined with multiple memory dies.”