High Speed Signal Propagation: Advanced Black Magic

By H. Johnson, M. H. Graham. 2003

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High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes (2011, background): “However, because the intrinsic impedance of Si is low at these frequencies, it acts as a shield to the electric fields [38], [39], causing them to be concentrated in the SiO2 layer.”
Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions (2010, background): “ture to calculate the skin-effect frequency-dependent resistance and inductance [12]–[14], it should be noted that the crowding and the proximity effects cause the direct calculations of the”
Breaking the challenge of signal integrity using time-domain spoof surface plasmon polaritons (2015, methodology): “Especially, the rapid developments of super-large-scale integration of high-speed circuits and wireless communication systems/devices have brought forward higher requirements to the signal interference suppression and signal integrity in the past decades (1).”