Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

By Sung K. Kang, D. Shih, N. Donald, W. Henderson, T. Gosselin, A. Sarkhel, NY. Charles Goldsmith, K. Puttlitz, W. K. Choi. 2003

181 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/848206c1572f5a2c548ee82dc7816165eed0fd65

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In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

Citations in the corpus

• A review: On the development of low melting temperature Pb-free solders (2014, background): “7Cu, [31] the position of the Ag3Sn liquidus is in the metastable region, which we deduce by direct extrapolation of the liquidus from the ternary eutectic temperature.”