Y. Wang
Biomedical Engineering · with Biddut · 2010
A researcher in the Science corpus: 1 paper; trusts 3 researchers and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Biomedical Engineering — 5 citations into it
Whom Y. Wang trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from Y. Wang's perspective
Ordered by how strongly the researchers Y. Wang trusts endorse each paper. Same corpus, a different order for every researcher.
- Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification
- AND T
- A chemical mechanical polishing model incorporating both the chemical and mechanical effects
- Chemical mechanical planarization for microelectronics applications
- Material removal mechanism in chemical mechanical polishing: theory and modeling
- Low-k dielectric materials
- Determination of pore-size distribution in low-dielectric thin films
- Investigation of creep behaviour under load during indentation experiments and its influence on hardness and modulus results
- A plasticity-based model of material removal in chemical-mechanical polishing (CMP)
- Mechanical Properties of Solid Polymers: Third Edition
Their papers
- Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers (2010) — 154 citations