A plasticity-based model of material removal in chemical-mechanical polishing (CMP)

By G. Fu, Abhijit Chandra, S. Guha, G. Subhash. 2001

168 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/d03af7e05ff616b1c1f98dc86231ad0e95447eb1

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Atomic and Molecular Physics, and Optics

1. David A. Dornfeld
2. Jianfeng Luo
3. V. Jain

In Biomedical Engineering

1. David A. Dornfeld
2. Jianfeng Luo
3. Fritz Klocke
4. Gerry Byrne
5. V. Jain
6. Yigit Karpat

In Mechanical Engineering

1. David A. Dornfeld
2. Jianfeng Luo
3. Fritz Klocke
4. Gerry Byrne
5. V. Jain
6. Yigit Karpat

Citations in the corpus

• Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification (2003, background): “In the “non-contact mode” proposed in [10] and [14], there is no need for abrasives to be closely packed to each other, which may be t case for a hard pad due to the small pad deformation [14].”
• Material Removal Mechanisms in Lapping and Polishing (2003, background): “148: G99-G109 [40] Yu T.K., Yu C.C. and M. Orlowski , in Proceeding of the 1993 International Electron Devices Meeting (1994), page 35.4.1 [41] Fu et al. (2001) op. cit [42] Luo J. and Dornfeld D. A. Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling”.”