Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification

By Jianfeng Luo, David A. Dornfeld. 2003

174 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/99e943e4574ebc3ea608f1151d45d4a2b8d010ec

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Fritz Klocke
2. David A. Dornfeld
3. Y. Wang
4. Gerry Byrne
5. Liangchi Zhang
6. A. Biddut
7. Yigit Karpat
8. Kim-Meow Liew

In Materials Chemistry

1. Liangchi Zhang
2. Kim-Meow Liew
3. Z. Lei

In Mechanical Engineering

1. Fritz Klocke
2. David A. Dornfeld
3. Gerry Byrne
4. Liangchi Zhang
5. Yigit Karpat
6. Weixing Xu
7. A. Pramanik
8. V. Jain

Citations in the corpus

• Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers (2010, background): “Many processing factors can significantly influence a CMP proess [4], such as properties of polishing pad, abrasive particles and hemical reagents.”
• Material Removal Mechanisms in Lapping and Polishing (2003, background): “In addition to the variables discussed above, they also show the effect of pad roughness and abrasive size disturibution [43].”