A chemical mechanical polishing model incorporating both the chemical and mechanical effects

By Kuide Qin, B. Moudgil, Chang-Won Park. 2003

177 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/59dbadff04dce24e681eebdff8b3cebe3527a777

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Y. Wang
2. Liangchi Zhang
3. A. Biddut
4. Kim-Meow Liew
5. Z. Lei
6. Weixing Xu

In Electrical and Electronic Engineering

1. Y. Wang
2. Liangchi Zhang
3. A. Biddut
4. Weixing Xu

In Mechanical Engineering

1. Liangchi Zhang
2. Weixing Xu

Citations in the corpus

• Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers (2010, background): “The coupled chemical–mechanical nteractions are believed to be responsible for the material removal n the polishing process [3].”