F. Ouyang

Electrical and Electronic Engineering · 2012–2013

A researcher in the Science corpus: 2 papers; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom F. Ouyang trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. King-Ning Tu

Papers from F. Ouyang's perspective

Ordered by how strongly the researchers F. Ouyang trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Solder Joint Technology
  2. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
  3. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
  4. Thermomigration in SnPb composite flip chip solder joints
  5. Optimization of grain boundary character distribution for intergranular corrosion resistant 304 stainless steel by twin-induced grain boundary engineering
  6. Generalized Gradient Approximation Made Simple.
  7. Electromigration in Sn-Pb solder strips as a function of alloy composition
  8. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
  9. Reducing porosity in AlSi10Mg parts processed by selective laser melting
  10. Size-dependent plasticity in an Nb25Mo25Ta25W25 refractory high-entropy alloy

Their papers